eMMCResults: 37
Kaihanga
SANDISK
SAMSUNG
| Hua | Rārangi Taputapu | Utu Utu | Nui |
|---|---|---|---|
eMMC 5.1 32 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production 
|
8960 (reri) |
|
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|
eMMC 5.0 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production
|
3477 (reri) |
Uiui
|
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eMMC 5.0 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production
|
14400 (reri) |
|
|
|
eMMC 5.1 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production
|
2000 (reri) |
|
|
|
eMMC 5.1 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production
|
3336 (reri) |
Uiui
|
|
|
eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production
|
5086 (reri) |
|
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|
eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production
|
4729 (reri) |
Uiui
|
|
|
eMMC 5.1 64 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C Mass Production
|
22900 (reri) |
|
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eMMC 5.1 128 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C Mass Production
|
5545 (reri) |
Uiui
|
|
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eMMC 5.0 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 105 °C Mass Production
|
5485 (reri) |
Uiui
|
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